package dimensions hlmp-cw70, hlmp-cw72 t-1 3/4 precision optical performance white led data sheet description this high intensity white led lamp is based on ingan material technology. a blue led die is coated by phos - phor to produce white. the typical resulting color is described by the coordinates x = 0.32, y = 0.32 using the 1931 cie chromaticity diagram. this t- 1 3/4 lamp is untinted, difused, and incorporate precise optics which produce well defned spatial radia - tion patterns at specifc viewing cone angle. applications ? electronic signs and signals ? small area illumination ? legend backlighting ? general purpose indicators features ? highly luminous white emission ? 70 viewing angle beneft ? reduced power consumption, higher reliability, and increased optical/mechanical design flexibility com - pared to incandescent bulbs and other alternative white light sources caution : these devices are class 1 esd sensitive. please observe appropriate precautions during handling and processing. refer to avago technologies application note an-1142 for additional details. .08 0.70 max .100 .015 .5 0.38 1. 31.60 min .093 .35 max .8 .008 5.80 0.0 .33 .008 8.71 0.0 .197 .008 5.00 0.0 note#1 .039 1.00 min .00 .00 0.50 0.10 sq. typ. .05 .008 1.1 0.0 cathode fla t cathode lead ? cathode lead cathode fla t notes: 1. measured just above flange. .059.006 1.500.15 .93 .010 1.5 0.5 .33 .008 8.71 0.0 .100 .015 .5 0.38 1. 31.60 min .00 .00 0.50 0.10 sq. typ. .039 1.00 min .197 .008 5.00 0.0 note#1 .8 .008 5.80 0.0 .08 0.70 max .05 .008 1.1 0.0 ? notes: 1. all dimensions are in millimeters / inches. 2. expoxy meniscus may extend about 1mm (0.040) down the leads. a. b.
absolute maximum ratings (ta = 25 c) electrical characteristics (ta = 25 c) part numbering system part number min luminous intensity iv (mcd) @ 20ma max luminous intensity iv (mcd) @ 20ma standof option package dimension HLMP-CW70-LP0XX 400 1150 no a hlmp-cw72-lp0xx 400 1150 yes b parameters value unit dc forward current [1] 30 ma peak forward current [2] 100 ma power dissipation 120 mw reverse voltage (ir = 10a) 5 v led junction temperature 110 o c operating temperature range -40 to +85 o c storage temperature range -40 to +100 o c forward voltage, v f (v) @ i f = 20 ma reverse breakdown, v r (v) @ i r = 10 m a capacitance, c (pf), v f = 0,f = 1 mhz thermal resistance r q j-pin (c/w) typ. max. min. typ. typ. 3.6 4.0 5 70 240 tolerance for intensity limit is 15% hlmp ? cw7x - x x x xx mechanical option 00: bulk dd: ammo pa ck color bin option 0: full color bin distribution maximum intensity bin limi t 0: no maximum intensity bin limi t minimum intensity bin limi t refer to device selection guid e viewing angle and standoff option 70 : 70 without standoff s 7 : 70 with standoffs device selection guide notes: 1. derate linearly as shown in figure 5. 2. duty factor 10%, 1 khz.
3 figure 1. relative intensity vs wavelength figure 2. forward current vs forward voltage figure 3. relative iv vs. forward current figure 4. chromaticity shift vs. current figure 5. maximum fwd. current vs temperature figure 6. spatial radiation pattern optical characteristics (ta = 25 c) 0.0 0. 0. 0.6 0.8 1.0 380 80 580 680 780 wavelength (nm) relative luminous intensity 0 10 0 30 0 1 3 forward voltage (v) forward current (ma) 0.0 0. 0. 0.6 0.8 1.0 1. 1. 0 1 0 0 3 0 forward current (ma) relative luminous intensity -0.010 -0.005 0 0.005 0.010 0.015 0.00 0.05 -0.00 -0.00 0 0.00 0.00 30ma 5ma 0ma 15ma 10ma 5ma 1ma x-coordinates y-coordinates (x,y) values @ 0ma reference to (0,0) 0 5 10 15 0 5 30 0 0 0 6 0 8 0 100 ambient temperature ( ? c) maximum forward current (ma) r q j-a =585?c/w r q j-a =780?c/w 0.0 0.5 1.0 -90 -60 -30 0 3 0 6 0 9 0 angular displacement (degree) relative luminous intensity notes: 1. the chromaticity coordinates are derived from the cie 1931 chromaticity diagram and represent the perceived color of the device. 2. 1/2 is the of-axis angle where the luminous intensity is ? the peak intensity. typical chromaticity coordinates [1] viewing angle 2 q 1/2 (degrees) [2] typ. x 0.32 y 0.32 70
intensity bin limits (mcd at 20 ma) color bin limit tables note: 1. bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago technologies representative for information on currently available 0.0 0.5 0.30 0.35 0.0 0.6 0. 3 0 .3 0 .3 8 x- c oor di na te y- c oor di na te 1 3 bl ac k b ody cu rv e limits (chromaticity coordinates) 1 x 0.330 0.330 0.356 0.361 y 0.360 0.318 0.351 0.385 2 x 0.287 0.296 0.330 0.330 y 0.295 0.276 0.318 0.339 3 x 0.264 0.280 0.296 0.283 y 0.267 0.248 0.276 0.305 4 x 0.283 0.287 0.330 0.330 y 0.305 0.295 0.339 0.360 bin intensity (mcd) at 20 ma min max k 310 400 l 400 520 m 520 680 n 680 880 p 880 1150 q 1150 1500 r 1500 1900 s 1900 2500 t 2500 3200 u 3200 4200 v 4200 5500 w 5500 7200 tolerance for each bin limit is 0.01 color bin limits with respect to cie 1931 chromaticity diagram tolerance for each bin limit is 15%.
5 wave soldering manual solder dipping pre-heat temperature 105 c max. - preheat time 30 sec max - peak temperature 250 c max. 260 c max. dwell time 3 sec max. 5 sec max bottom side of pc board top side of pc board note: allow for boards to be sufficiently cooled before exerting mechanical force. conveyor speed = 1.83 m/min (6 ft/min) preheat setting = 150 c (100 c pcb) solder wave temperature = 5 c air knife air temperature = 390 c air knife distance = 1.91 mm (0.5 in.) air knife angle = 0 solder: sn63; flux: rma 50 00 150 fluxing turbulent wave preheat time - seconds temperature - ?c 100 50 30 0 1 0 0 3 0 0 5 0 6 0 7 0 8 0 9 0 100 laminar wave hot air knife led component lead size diagonal plated through hole diameter 0.457 x 0.457mm (0.025 inch) 0.646 mm (0.038 to 0.042 inch) (0.018 x 0.018inch) 0.976 to 1.078 mm 0.508 x 0.508mm (0.028 inch) 0.718 mm (0.041 to 0.045 inch (0.020 x 0.020inch) 1.049 to 1.150mm precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering into pc board. ? if lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to led package. otherwise, cut the leads of led to length after soldering process at room temperature. the solder joint formed will ab - sorb the mechanical stress of the lead cutting from traveling to the led chip die attach and wirebond. ? it is recommended that tooling made to precisely form and cut the leads to length rather than rely upon hand operation. soldering condition: ? care must be taken during pcb assembly and solder - ing process to prevent damage to led component. ? the closest led is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standof. ? recommended soldering condition: recommended wave soldering profle note: refer to application note an1027 for more information on sol - dering led components. ? wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. customer is advised to pe - riodically check on the soldering profle to ensure the soldering profle used is always conforming to recommended soldering condition. ? if necessary, use fxture to hold the led component in proper orientation with respect to the pcb during soldering process. ? proper handling is imperative to avoid excessive thermal stresses to led components when heated. therefore, the soldered pcb must be allowed to cool to room temperature, 25c before handling. ? special attention must be given to board fabrication, solder masking, surface plating and lead holes size and component orientation to assure solderability. ? recommended pc board plated through holes size for led component leads.
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies, pte. in the united states and other countries. data subject to change. copyright ? 2006 avago technologies pte. all rights reserved. 5989-4123en - may 9, 2006
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